No-Clean BGA Solder Paste (10cc) (different sets available)

This flux paste is designed to simplify delicate phone CPU rebelling and soldering repair work.

Its low-residue, no-clean formulation helps maintain a clean workspace while supporting smoother, more controlled welding during precision electronic repairs.

Main Features

• Low residue formula for cleaner soldering results
• No-clean flux, reducing post-repair cleaning effort
• Suitable for phone CPU reballing and electronic repair tasks
• Designed as a soldering grease for welding and repair applications

Specification

• Volume: 10CC
• Application: Phone CPU rebelling, soldering, welding repair
• Certification: CE