This environment-friendly soldering paste is specially formulated for precise soldering tasks like mobile phone PCB repairs and chip-level work.
Its buttery texture makes it easy to apply, while the rosin-based formula enhances bonding and minimizes oxidation, resulting in clean, efficient soldering with excellent conductivity.
Main Features
High Bonding Strength – Ensures reliable and durable solder joints.
Oxide Removal & Prevention – Rosin content actively removes and prevents oxidation during soldering.
Smooth Finish – Produces a clean, even soldering surface with good insulation.
Improves Fluidity – Reduces surface tension for better wetting and easier soldering of small components.
Eco-Friendly & Safe – Neutral pH and safe for use in precision electronics.
